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High Quality Pressure Sensing Insole Sensor Wholesale from China Factory smart insole source manufacturer
Product Description
Product Description
| Layer No. | 1-8 Layers |
| PCB Test | Flying probe and AOI (Default)/Fixture Test |
| Base, Cover film, Stiffeners thickness: | 0.5mil, 1.0mil, 2.0mil, 3.0mil, 4.0mil, 5.0mil, 6.0mil,0.10um |
| BGA Ball Pitch | 1mm ~ 3mm(4mil ~ 12mil) |
| PCB Assembly Method | SMT, Through-hole, Mixed, BGA |
| PCB Assembly Test | Visual Inspection (default), AOI, FCT, X-RAY |
| Hi-TG FR4 Material | Tg-130 Tg-140 Tg-160 Tg-170 |
| Electrical Testing | Net List Test, Flying Probe Test, Through Hole Test, Dual Access Test |
| Certificate Standard | IPC-A-600H Class 2, Class 3, TS16949,ROHS and as your need |
| Special requirements | Buried and blind vias, Impedance control, via plug, BGA soldering etc. |
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Frequently Asked Questions
What layer counts can you manufacture for PCBs?
We provide PCB manufacturing ranging from 1 to 8 layers to meet standard and complex circuit application requirements.
What quality testing methods are performed on PCBs and assemblies?
Our testing includes Flying Probe, AOI (Automated Optical Inspection), Fixture Test, Net List Test, Through Hole Test, Dual Access Test, Visual Inspection, FCT, and X-Ray analysis.
Which assembly methods are supported?
We support Surface Mount Technology (SMT), Through-hole assembly, Mixed assembly technologies, and specialized BGA mounting.
What standards and certifications do the boards comply with?
Manufacturing conforms to IPC-A-600H Class 2 and Class 3, TS16949, and ROHS compliance standards.
Can you handle complex board specifications and special requirements?
Yes, we handle advanced requirements including buried and blind vias, controlled impedance, via plugs, fine BGA ball pitch soldering (1mm–3mm), and high-Tg FR4 materials (Tg-130 to Tg-170).
